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VAP series wafer level plasma activation system
Applications: surface pretreatment before wafer-level packaging, surface activation before wafer-level bonding, surface activation before photoresist coating, removal of small particles on the wafer surface, removal of organic residues on the surface, etc.

Features: Compatible with multi-size wafers, multi-reaction chamber customization, ultra-clean reaction chamber, effective control of various pollutants, control of environmental pollutants in the whole machine space, radio frequency plasma generator or dual-frequency plasma generator, crystal The round surface has little damage and can be used for surface activation of patterned wafers, with high plasma density and good uniformity.
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Number Content Specification Parameters
1 Overall structure The system with load port is divided into front-end equipment operation unit, front-end EFEM unit and plasma processing unit, and the front-end EFEM system and plasma processing unit are designed separately
2 Plasma source RF plasma source or dual frequency plasma source
3 Reaction chamber The standard design is double reaction chamber, and single reaction chamber and multi-reaction chamber structure can be customized according to requirements
4 Mechanical transfer Single-arm or double-arm high-precision manipulator
5 Wafer lifting Mechanical Wafer pin lifting structure, Wafer pin adopts specific process
6 Front vacuum pump Dry vacuum pump, choose 100-300m3/h specification according to the installation location and process
7 High Vacuum Pump Molecular pump (water cooling or CDA cooling)
8 Process Pressure Control Automatic pressure regulating butterfly valve
9 Vacuum detection Pipeline vacuum gauge, full range vacuum gauge for reaction chamber, process vacuum gauge, differential pressure switch
10 Process gas type Standard configuration of high-purity Ar, N2, O2, other high-purity process gases can be added
Main applications of the equipment: surface pretreatment before wafer-level packaging, surface activation before wafer-level bonding, surface activation before photoresist coating, removal of small particles on the wafer surface, removal of organic residues on the surface, etc.

Main features of the equipment: Compatible with multi-size wafers, multi-reaction chamber customization, ultra-clean reaction chamber, effective control of various pollutants, control of environmental pollutants in the whole machine space, radio frequency plasma generator or dual-frequency plasma generator , Wafer surface damage is small, can be used for surface activation of patterned wafers, high plasma density, good uniformity.
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